Earthquake Engineering and Resilience
3D Printing of Strain-Hardening Cementitious Composite (SHCC) and Its Structural Applications
Presenter: Assistant Professor Ye Qian (The University of Hong Kong)
Time: 14:00 -- 15:30, Friday, October 13, 2023
Platform: Tencent Meeting, ID:549-128-231
Inviter: Jie, XU
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